封装贴片/插件
温度-40/85/125
包装卷装
质量好
资料请联系唐先生
Stanson Technology was formed in 1981 and the business was concentrated in exporting semiconductor equipment and parts at
DC/DC converters, power MOSFET, LED drivers, etc. for 3C applications such as LCD Moniter/TV, DSC,Disk Array,
Our products are approved not only by the local major factories but also by the overseas clients .
Although, it is under heavy competition, Stanson Technology is always able to provide customers with high quality products and acceptable price.
Our wafers are fabed with various foundry houses in Taiwan and China . Packaging and testing are in China .
MOS是金属氧化物半导体（Metal-Oxide-Semiconductor）的缩写，是一种常见的半导体器件结构。MOS结构由金属电、氧化物绝缘层和半导体材料组成。
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